PEI

Short Description:

• Physical:
• Density: 1.27
• Bulk Density: /
• Mold Shrinkage (Machine Direction): /
• Mold Shrinkage (Transverse Direction): /
• Mold Shrinkage: 0.5-0.7
• Melt Flow Rate (337℃. 6.6Kg): 8-9
• Melt Flow Rate (316℃. 5.0Kg): /
• Melt Flow Rate: /
• Melt Viscosity (380℃.77HZ): /
• MVR(380℃.5kg): /
• Particle size (D50): /
• Water Absorption (24h @23°C): 0.25
• Friction Coefficient (23℃):
• Mass Wear Loss (23℃):
• Flammability(1.6 mm): /
• Ash Content: /
• Moisture Content: /
• Volatile: /
• Mechanical :
• Tensile Stress at Break :
• Tensile Stress at Break (5 mm/min): 108
• Tensile Modulus at Break :
• Tensile Modulus at Break (1 mm/min): 3.5
• Elongation at Break (23℃): 60
• Flexural Modulus at Break (23℃): 3.2
• Flexural Strength at Break (23℃): 150
• Flexural Strength at Break :
• Notched Izod Impact Strength @23℃ (V-notched): 6.5
• Notched Izod Impact Strength @-30℃ (V-notched): /
• Unnotched Izod Impact Strength @23℃: /
• Co-eff.of Friction, Static/Dynamic:
• Rockwell hardness (23℃): /
• Rockwell Hardness (M-Scale): /
• Rockwell Hardness (R-Scale): /
• Thermal :
• Melting Temperature (10°C/min): /
• Glass transition Temp.(10℃/min) :
• Glass transition Temp.:
• Melting Point: /
• Heat Deflection Temp. High Load (1.8 MPa): 193
• Coeff. of Linear Them. Expansion (-50~-20℃) TD/MD:
• Coeff. of Linear Them. Expansion (-20~0℃) TD/MD:
• Coeff. of Linear Them. Expansion (0~23℃) TD/MD:
• Coeff. of Linear Them. Expansion (23~50℃) TD/MD:
• Coeff. of Linear Them. Expansion (50~70℃) TD/MD:
• Coeff. of Linear Them. Expansion (70~100℃) TD/MD:
• Coeff. of Linear Them. Expansion (100~120℃) TD/MD:
• Coeff. of Linear Them. Expansion (120~140℃) TD/MD:
• Tg（0°C/min）: /
• Coeff. Of Linear Them. Expansion (parallel): 0.52
• Coeff. Of Linear Them. Expansion (normal): 0.52
• Thermal Conductivity :
• Thermal conductivity (through plane) :
• Thermal Diffusivity (through plane) :
• Flammability (0.3 mm): V-0
• Flammability (3.0 mm): V-0
• Flammability :
• Glass Transition (Tg): 217
• Melt Flow Rate (380℃, 5kg): /
• Thermal expansion coefficient (T<Tg) along flow: /
• Thermal expansion coefficient (T>Tg) along flow: /
• Thermal expansion coefficient (T<Tg) across flow: /
• Thermal expansion coefficient (T>Tg) across flow: /
• Thermal expansion coefficient (T<Tg): /
• Thermal expansion coefficient (T>Tg): /
• Thermal conductivity (23℃): /
• Electrical Properties:
• Dielectric Strength (60*60*1mm³): 32
• Relative Permittivity (100Hz&1MHz): 3.15
• Dissipation Factor (100Hz&1MHz): 0.0015
• Relative Permittivity (2.5 GHz):
• Dissipation Factor (2.5 GHz):
• Relative Permittivity (1MHz):
• Dissipation Factor (1MHz):
• Dielectric Strength: /
• Relative Permittivity (4 GHz): /
• Dissipation Factor (4 GHz): /
• Volume Resistivity: 10^15
• Surface Resistivity: 10^15
• CTI: 150
• CTI: /
• Typical Processing Conditions:
• Drying Temp. / Time: /
• Injection Pressure: /
• Injection Speed: /
• Injection Molding Melt Temp.: /
• Injection Molding Mold Temp.: /
• Extrsuion/Blow Molding Melt Temp.: /
• Temperature Settings: /
• Hopper Temperature: /
• Gate: /
• Process Temperature: /