PEEK

Short Description:

• Physical:
• Density: 1.82
• Bulk Density:
• Mold Shrinkage (Machine Direction): 0.30
• Mold Shrinkage (Transverse Direction): 0.35
• Mold Shrinkage:
• Melt Flow Rate (337℃. 6.6Kg):
• Melt Flow Rate (316℃. 5.0Kg):
• Melt Flow Rate:
• Melt Viscosity (380℃.77HZ):
• MVR(380℃.5kg):
• Particle size (D50):
• Water Absorption (24h @23°C): 0.03
• Friction Coefficient (23℃):
• Mass Wear Loss (23℃):
• Flammability(1.6 mm): V-0
• Ash Content:
• Moisture Content:
• Volatile:
• Mechanical :
• Tensile Stress at Break :
• Tensile Stress at Break (5 mm/min): 105
• Tensile Modulus at Break :
• Tensile Modulus at Break (1 mm/min): 16.0
• Elongation at Break (23℃): 1.2
• Flexural Modulus at Break (23℃): 15.0
• Flexural Strength at Break (23℃): 190
• Flexural Strength at Break :
• Notched Izod Impact Strength @23℃ (V-notched): 4.0
• Notched Izod Impact Strength @-30℃ (V-notched):
• Unnotched Izod Impact Strength @23℃:
• Co-eff.of Friction, Static/Dynamic:
• Rockwell hardness (23℃):
• Rockwell Hardness (M-Scale):
• Rockwell Hardness (R-Scale):
• Thermal :
• Melting Temperature (10°C/min): 343
• Glass transition Temp.(10℃/min) :
• Glass transition Temp.:
• Melting Point:
• Heat Deflection Temp. High Load (1.8 MPa): 249
• Coeff. of Linear Them. Expansion (-50~-20℃) TD/MD: 8.9/9.5
• Coeff. of Linear Them. Expansion (-20~0℃) TD/MD: 15.0/14.9
• Coeff. of Linear Them. Expansion (0~23℃) TD/MD: 16.2/16.0
• Coeff. of Linear Them. Expansion (23~50℃) TD/MD: 16.9/16.8
• Coeff. of Linear Them. Expansion (50~70℃) TD/MD: 17.4/17.2
• Coeff. of Linear Them. Expansion (70~100℃) TD/MD: 18.1/18.0
• Coeff. of Linear Them. Expansion (100~120℃) TD/MD: 19.6/19.1
• Coeff. of Linear Them. Expansion (120~140℃) TD/MD: 24.7/24.5
• Tg（0°C/min）:
• Coeff. Of Linear Them. Expansion (parallel): /
• Coeff. Of Linear Them. Expansion (normal): /
• Flammability (0.3 mm): /
• Flammability (3.0 mm): /
• Glass Transition (Tg): 148
• Melt Flow Rate (380℃, 5kg): /
• Thermal expansion coefficient (T<Tg) along flow:
• Thermal expansion coefficient (T>Tg) along flow:
• Thermal expansion coefficient (T<Tg) across flow:
• Thermal expansion coefficient (T>Tg) across flow:
• Thermal expansion coefficient (T<Tg):
• Thermal expansion coefficient (T>Tg):
• Thermal conductivity (23℃):
• Electrical Properties: /
• Dielectric Strength (60*60*1mm³): 25
• Relative Permittivity (100Hz&1MHz): 3.2
• Dissipation Factor (100Hz&1MHz): 0.005
• Relative Permittivity (1MHz):
• Dissipation Factor (1MHz):
• Dielectric Strength:
• Relative Permittivity (4 GHz): /
• Dissipation Factor (4 GHz): /
• Volume Resistivity: 10^16
• Surface Resistivity: 10^16
• CTI: 200
• CTI:
• Typical Processing Conditions:
• Drying Temp. / Time: 150℃&3h or 120℃&5h(residual moisture<0.02%)
• Injection Pressure: /
• Injection Speed:
• Injection Molding Melt Temp.: 170℃~200℃
• Injection Molding Mold Temp.: /
• Extrsuion/Blow Molding Melt Temp.:
• Temperature Settings: 370-410℃
• Hopper Temperature: Not greater than 100℃
• Gate: >2mm or 0.5×part thickness
• Process Temperature: