PPS

Short Description:

• Physical:
• Density: 1.55
• Bulk Density:
• Mold Shrinkage (Machine Direction): 0.30
• Mold Shrinkage (Transverse Direction): 0.80
• Mold Shrinkage:
• Melt Flow Rate (337℃. 6.6Kg):
• Melt Flow Rate (316℃. 5.0Kg):
• Melt Flow Rate:
• Melt Viscosity (380℃.77HZ):
• Particle size (D50):
• Water Absorption (24h @23°C): 0.30
• Flammability(1.6 mm):
• Ash Content:
• Moisture Content:
• Volatile:
• Mechanical :
• Tensile Stress at Break (5 mm/min): 190
• Tensile Modulus at Break (1 mm/min): /
• Elongation at Break (23℃): 2.0
• Flexural Modulus at Break (23℃): 12
• Flexural Strength at Break (23℃): 270
• Notched Izod Impact Strength @23℃ (V-notched): 10
• Notched Izod Impact Strength @-30℃ (V-notched): 10
• Unnotched Izod Impact Strength @23℃:
• Rockwell hardness (23℃):
• Rockwell Hardness (M-Scale):
• Rockwell Hardness (R-Scale):
• Thermal :
• Melting Temperature (10°C/min): 280
• Melting Point:
• Heat Deflection Temp. High Load (1.8 MPa): 250
• Tg（0°C/min）:
• Coeff. Of Linear Them. Expansion (parallel):
• Coeff. Of Linear Them. Expansion (normal):
• Flammability (0.3 mm): V-0
• Flammability (3.0 mm): V-0
• Glass Transition (Tg):
• Melt Flow Rate (380℃, 5kg):
• Thermal expansion coefficient (T<Tg) along flow:
• Thermal expansion coefficient (T>Tg) along flow:
• Thermal expansion coefficient (T<Tg) across flow:
• Thermal expansion coefficient (T>Tg) across flow:
• Thermal expansion coefficient (T<Tg):
• Thermal expansion coefficient (T>Tg):
• Thermal conductivity (23℃):
• Electrical Properties:
• Dielectric Strength (60*60*1mm³):
• Relative Permittivity (100Hz&1MHz):
• Dissipation Factor (100Hz&1MHz):
• Dielectric Strength: 22
• Relative Permittivity (4 GHz): 4.0
• Dissipation Factor (4 GHz): 0.003
• Volume Resistivity: 10^15
• Surface Resistivity: /
• CTI: >270
• CTI:
• Typical Processing Conditions:
• Drying Temp. / Time: 150℃&3h
• Injection Pressure: 30~100
• Injection Speed:
• Injection Molding Melt Temp.: 290~330
• Injection Molding Mold Temp.: 120~160
• Extrsuion/Blow Molding Melt Temp.:
• Temperature Settings:
• Hopper Temperature:
• Gate:
• Process Temperature: