PPS

Short Description:

• Physical:
• Density: 1.4
• Bulk Density: /
• Mold Shrinkage (Machine Direction): 0.30
• Mold Shrinkage (Transverse Direction): 0.70
• Mold Shrinkage: /
• Melt Flow Rate (337℃. 6.6Kg): /
• Melt Flow Rate (316℃. 5.0Kg): /
• Melt Flow Rate: /
• Melt Viscosity (380℃.77HZ): /
• Particle size (D50): /
• Water Absorption (24h @23°C): 0.04
• Flammability(1.6 mm): /
• Ash Content: /
• Moisture Content: /
• Volatile: /
• Mechanical :
• Tensile Stress at Break (5 mm/min): 155
• Tensile Modulus at Break (1 mm/min): /
• Elongation at Break (23℃): 0.8
• Flexural Modulus at Break (23℃): 16
• Flexural Strength at Break (23℃): 235
• Notched Izod Impact Strength @23℃ (V-notched): 6.0
• Notched Izod Impact Strength @-30℃ (V-notched): 6.0
• Unnotched Izod Impact Strength @23℃: /
• Rockwell hardness (23℃): /
• Thermal :
• Melting Temperature (10°C/min): 280
• Melting Point: /
• Heat Deflection Temp. High Load (1.8 MPa): 260
• Tg（0°C/min）: /
• Coeff. Of Linear Them. Expansion (parallel): 0.15
• Coeff. Of Linear Them. Expansion (normal): 0.3
• Flammability (0.3 mm): V-0
• Flammability (3.0 mm): V-0
• Glass Transition (Tg): /
• Melt Flow Rate (380℃, 5kg): /
• Thermal expansion coefficient (T<Tg) along flow: /
• Thermal expansion coefficient (T>Tg) along flow: /
• Thermal expansion coefficient (T<Tg) across flow: /
• Thermal expansion coefficient (T>Tg) across flow: /
• Thermal expansion coefficient (T<Tg): /
• Thermal expansion coefficient (T>Tg): /
• Thermal conductivity (23℃): /
• Electrical Properties:
• Dielectric Strength (60*60*1mm³): /
• Relative Permittivity (100Hz&1MHz): /
• Dissipation Factor (100Hz&1MHz): /
• Dielectric Strength: /
• Relative Permittivity (4 GHz): /
• Dissipation Factor (4 GHz): /
• Volume Resistivity: <10^3
• Surface Resistivity: <10^3
• CTI: /
• Typical Processing Conditions: /
• Drying Temp. / Time: 150°C&3h
• Injection Pressure: 30~100
• Injection Speed: /
• Injection Molding Melt Temp.: 290~330
• Injection Molding Mold Temp.: 120~160
• Extrsuion/Blow Molding Melt Temp.:
• Temperature Settings:
• Hopper Temperature:
• Gate:
• Process Temperature: